OS-B-25 - DESOLDERING BRAID, ONE-STEP, 0.050'' x 25' (1.27 MM x 7.63 M)
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* This is not a formal quote. Prices may change without notice.
Features
- Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics
- Easily removes solder from components or pads on a circuit board
- Concentrated fine copper braiding utilises less length of wick for each desoldering application
- Made of clean, oxide-free copper wire; tight weave enables quick “on and off” desoldering
- Flux residue on board does not need to be cleaned
- To be used in conjunction with processes using RMA type no-clean fluxes
- Uses flux classification type L0 per IPC J-STD-004B - compatible with R, RA, RMA, and NC type fluxes
- Contact Us for static dissipative bobbins