OS-B-5AS-DESOLDERING BRAID, ONE STEP, 1.3 MM X 1.5 M, ANTISTATIC, 25/PACK

OS-B-5AS-DESOLDERING BRAID, ONE STEP, 1.3 MM X 1.5 M, ANTISTATIC, 25/PACK OS-B-5AS-DESOLDERING BRAID, ONE STEP, 1.3 MM X 1.5 M, ANTISTATIC, 25/PACK OS-B-5AS-DESOLDERING BRAID, ONE STEP, 1.3 MM X 1.5 M, ANTISTATIC, 25/PACK              

OS-B-5AS - One-Step Desoldering Braid, 1.3 mm x 1.5 m, Pack of 25

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Qty: 1 $121.04
Qty: 1 $133.14

In-stock orders will ship in 3 business days or less after receipt of order.

Stock: 0

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Estimated Lead-Time: 10 Weeks

Sold Per: 25 PACK

Gross Weight2: 0.16 kg

2The weight listed is gross product weight including standard packaging, actual shipment weight may vary.

Stock Location: LETCHWORTH, HERTFORDSHIRE

Country Of Origin: USA

Tariff No: 74081910


This item is built-to-order. Please contact Customer Service for accurate Lead-Times. Orders will be accepted for a minimum of 1. Orders for built-to-order items cannot be cancelled.

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  • Used in the rework and repair of printed circuit boards, computers, cell phones, or other electronics
  • Easily remove solder from components or pads on a circuit board
  • Concentrated fine copper braiding utilises less length of wick for each desoldering application
  • Made of clean, oxide-free copper wire and tight weave enables quick “on and off” desoldering
  • Flux residue on board does not need to be cleaned
  • High SIR--conforming to Bellcore specification GR-78-CORE (TR-TSY-000078), and IPC Test Method III
  • To be used in conjunction with processes using RMA type no-clean fluxes; conforms to requirements of ANSI/J-STD-004, Type LO
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