OS-D-25 - DESOLDERING BRAID, ONE STEP, 2.54 MM X 7.62 M
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* This is not a formal quote. Prices may change without notice.
Features
- Used in the rework and repair of printed circuit boards, computers, cell phones or other electronics
- Easily remove solder from components or pads on a circuit board
- Concentrated fine copper braiding utilises less length of wick for each desoldering application
- Made of clean, oxide-free copper wire and tight weave enables quick “on and off” desoldering
- Flux residue on board does not need to be cleaned
- High SIR--conforming to Bellcore specification GR-78-CORE (TR-TSY-000078), and IPC Test Method III
- To be used in conjunction with processes using RMA type no-clean fluxes; conforms to requirements of ANSI/J-STD-004, Type LO
- Contact Us for static dissipative bobbins